Microwave substrate components

I. Overview
Using semiconductor thin film vacuum evaporation, sputtering, electroplating, photolithography, laser trimming, scribing and other processes, pattern metallization on the surface of ceramic substrates (or special substrates), while integrating resistors, capacitors, inductors, etc., to produce Circuit substrates with specific functions have functions such as electrical connection, physical support, and heat dissipation, and are used in hybrid integrated circuit microwave devices.

2. Product features
High frequency, high precision, high reliability

3. technical indicators
Material: Al2O3.
Accuracy: line width/line spacing accuracy ±2.5um.
Metalization: Ti, Ni, Pt, Au, TaN resistors, prefabricated AuSn films, etc.; meet the requirements of gold wire bonding, SnPb/AuSn/AuSi/AuGe welding, and conductive adhesive bonding.
Others: Wrap around on the side, through holes (through hole resistance is less than 50 milliohms).

Komponen substrat microwave

I. Ikhtisar

Menggunakan evaporasi vakum film tipis semikonduktor, sputtering, elektroplating, fotolitografi, laser trimming, scribing dan proses lainnya, pola metalisasi pada permukaan substrat keramik (atau substrat khusus), sambil mengintegrasikan resistor, kapasitor, induktor, dll., untuk menghasilkan substrat Sirkuit dengan fungsi tertentu memiliki fungsi seperti sambungan listrik, dukungan fisik, dan pembuangan panas, dan digunakan dalam perangkat gelombang mikro sirkuit terpadu hibrida.